Product
CSPD Family

The CSPD family is a series of high-performance Chip Surge Protection Devices developed by SFI using advanced professional technologies.

 

CSPD exhibits excellent electrical characteristics including breakdown voltage, nonlinear α value, leakage current (Ir), and a tightly distributed capacitance with minimal deviation not only overcome the limitations of conventional market solutions such as gas discharge tubes (GDTs), metal oxide varistors (MOVs), and transient voltage suppressors (TVSs), but also offer superior protection performance.

With its ultra-low clamping voltage and rapid response time, CSPD provides enhanced protection and can withstand multiple surge current impacts.



Internal Structure


Operating Principle

SFI’s R&D center has pioneered an innovative approach to zinc oxide (ZnO) varistor material preparation. After more than five years of dedicated research, the scientific validity and commercial potential of this method were firmly established. This breakthrough led to the development of a wide range of high-performance ZnO ceramic materials many now in mass production under the CSPD series.

These materials not only meet but consistently exceed international standards. By utilizing low-temperature sintering, pure silver inner electrodes, and non-toxic solvents, SFI’s process significantly reduces environmental impact and minimizes the use of precious metals such as platinum and palladium:

  1. Introduction of a novel concept.
  2. Pioneered the world’s first use of low-temperature sintering with pure silver inner electrodes.
  3. Developed zinc oxide varistor ceramics with a high electric field gradient among the best globally.
  4. Achieved the highest surge current endurance in zinc oxide varistor ceramics worldwide.
  5. Engineered zinc oxide varistor ceramics for ultra-high temperature operation setting the global benchmark.

Reducing energy consumption, creating a green workplace, and protecting the global environment


Features

  1. Compact size with high energy capacity, ideal for high-density circuits
  2. Fast response to overvoltage events
  3. Capable of absorbing multiple surge pulses
  4. Low leakage current
  5. Bidirectional protection
  6. Excellent high-temperature performance
  7. Non-polarized design for easy PCB layout
  8. Easily scalable for mass production
  9. Batch-level testing ensures consistent quality

 

 

SGD Family

The SGD Family features a newly developed and innovative packaging technology using two PCBs (with internal routing) to extract wafer characteristics. These devices function as overvoltage protection components with performance equivalent to TVS, offering better surge current capacity and easier assembly.

SGD products are connected in parallel to electronic circuits for protection, and are commonly used in ESD protection for signal lines such as USB, HDMI, and RF interfaces, as well as in 3C products, industrial control systems, automotive communication, and medical electronics.



Internal Structure



Operating Principle

SFI’s newly developed semiconductor packaging process for SGD replaces traditional wire bonding with a Clipper Bond (lead-free solder paste) surface contact method. This dramatically increases electrode contact area, improving surge current resistance, enhancing production yield, and reducing manufacturing time.

Using the same process, TVS diodes, switching diodes, and Schottky diodes can be surface-mounted (SMD), replacing traditional through-hole components. This allows space-saving designs that align with the trend toward thinner, lighter, and more compact systems.




Key Features

  1. Compact size with high energy handling—ideal for high-density circuits
  2. Fast overvoltage response
  3. Improved energy absorption through surface contact bonding instead of wire bonding
  4. Low leakage current
  5. Bidirectional protection
  6. Ultra-low capacitance
  7. Non-polarized design for easy PCB layout
  8. Suitable for mass production
  9. Batch-level inspection ensures consistent quality
  10. Wide variety of specifications available in different sizes, voltages, currents, and capacitance levels

 



 Ideal for ESD protection in USB, HDMI, RF interfaces, as well as consumer electronics, automotive signal protection and more.

Product Series
MLV Family

The MLV Family comprises surface-mounted multilayer varistors (MLV) widely used in ESD/surge protection applications such as USB, HDMI, and RF interfaces as well as lightning protection, industrial control systems, and automotive electronics.

Internal Structure

Operating Principle

Zinc oxide grains are surrounded by a high-impedance bismuth-rich phase, forming a special non-ohmic contact. Under normal voltage conditions, this structure maintains high impedance and extremely low leakage current, contributing to power efficiency. When surge voltage occurs and exceeds a threshold, a breakdown happens, rapidly dropping the impedance to 0.5–3Ω and diverting the current to ground, thus achieving surge protection.

Key Features

  1. Compact size, ideal for high-density circuit designs
  2. Fast response to overvoltage events
  3. Capable of absorbing repeated surges (e.g., ESD, lightning)
  4. Low leakage current
  5. Bidirectional protection
  6. Excellent temperature stability
  7. Cost-effective and suitable for mass production
  8. Non-polarized design for easy layout
  9. Available in various sizes, voltages, currents, and capacitance values